Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Patent
1993-10-28
1997-01-07
Thomas, Laura
Electricity: conductors and insulators
Conduits, cables or conductors
Preformed panel circuit arrangement
174262, 174261, 439 83, 257737, 257738, 361767, 361768, 361770, 361777, H06K 114
Patent
active
055919413
ABSTRACT:
High melting temperature Pb/Sn 95/5 solder balls are connected to copper pads on the bottom of a ceramic chip carrier substrate by low melting temperature eutectic Pb/Sn solder. The connection is made by quick reflow to prevent dissolving Pb into the eutectic solder and raising its melting temperature. Then the module is placed on a fiberglass-epoxy circuit board with the solder balls on eutectic Pb/Sn solder bumps on copper pads of the board. The structure is reflowed to simultaneously melt the solder on both sides of the balls to allow each ball to center between the carrier pad and circuit board pad to form a more symmetric joint. This process results in structure that are more reliable under high temperature cycling. Also, to further improve reliability, the balls are made as large as the I/O spacing allows without bridging beam on balls; the two pads are about the same size with more solder on the smaller pad; the pads are at least 75% of the ball diameter; and the eutectic joints are made as large as possible without bridging between pads. For reliability at even higher temperature cycles or larger substrate sizes columns are used instead of balls.
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Acocella John
Banks Donald R.
Benenati Joseph A.
Caulfield Thomas
Corbin, Jr. John S.
Belk Michael E.
International Business Machines - Corporation
Thomas Laura
LandOfFree
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