4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Combined with electrical contact or lead
  6. Of specified material other than unalloyed aluminum

Darrell Erb

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Copper pellet for reducing electromigration effects associated w

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Patent

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Copper reservoir for reducing electromigration effects associate

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Patent

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Predicting EM reliability by decoupling extrinsic and...

Computer-aided design and analysis of circuits and semiconductor – Nanotechnology related integrated circuit design
Reexamination Certificate

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Selective nonconformal deposition for forming low dielectric ins

Semiconductor device manufacturing: process – Coating of substrate containing semiconductor region or of... – Multiple layers
Patent

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Semiconductor device using uniform nonconformal deposition for f

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Patent

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Profile ID: LFUS-PAI-P-182329

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