4. Semiconductor device manufacturing: process
  5. Coating with electrically or thermally conductive material
  6. To form ohmic contact to semiconductive material

Consuelo N. Tangpuz

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Flip chip in leaded molded package and method of manufacture...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
Reexamination Certificate

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Flip chip in leaded molded package and method of manufacture...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With bumps on ends of lead fingers to connect to semiconductor
Reexamination Certificate

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Flip chip in leaded molded package and method of manufacture...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Reexamination Certificate

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Flip chip in leaded molded package and method of manufacture...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With bumps on ends of lead fingers to connect to semiconductor
Reexamination Certificate

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Integrated transistor module and method of fabricating same

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2487640

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