Integrated transistor module and method of fabricating same

Details Integrated transistor module and method of fabricating same Integrated transistor module and method of fabricating same

2009-01-06

2010-11-30

Pizarro, Marcos D. (Department: 2814)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

C257SE21510, C257SE21705

Reexamination Certificate

active

07842555

ABSTRACT:
An integrated transistor module includes a lead frame that defines at least one low-side land and at least one high-side land. A stepped portion of the lead frame mechanically and electrically interconnects the low-side and high-side lands. A low-side transistor is mounted upon the low-side land with its drain electrically connected to the low-side land. A high-side transistor is mounted upon the high-side land with its source electrically connected to the high-side land.

REFERENCES:
patent: 5703399 (1997-12-01), Majumdar et al.
patent: 6710441 (2004-03-01), Eden et al.
patent: 6841869 (2005-01-01), Triantafyllou et al.
patent: 6894397 (2005-05-01), Pavier et al.
patent: 6919644 (2005-07-01), Uchida
patent: 7061102 (2006-06-01), Eghan et al.
patent: 7501702 (2009-03-01), Joshi et al.
patent: 2003/0011005 (2003-01-01), Joshi
patent: 2004/0061221 (2004-04-01), Schaffer
patent: 2005/0285238 (2005-12-01), Joshi et al.

Affiliated with

Also associated with

Rating

Integrated transistor module and method of fabricating same does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Integrated transistor module and method of fabricating same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Integrated transistor module and method of fabricating same will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4184225