Bump-on-lead flip chip interconnection

Details Bump-on-lead flip chip interconnection Bump-on-lead flip chip interconnection

2008-05-06

2008-05-06

Lee, Hsien-Ming (Department: 2823)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

C257S737000, C257S778000, C257S781000, C257SE23021, C438S106000, C438S108000

Reexamination Certificate

active

10985654

ABSTRACT:
A flip chip interconnect is made by mating the interconnect bump directly onto a lead, rather than onto a capture pad. Also, a flip chip package includes a die having solder bumps attached to interconnect pads in an active surface, and a substrate having electrically conductive traces in a die attach surface, in which the bumps are mated directly onto the traces. In some embodiments the interconnection is formed without employing a solder mask. In some methods a curable adhesive is dispensed either onto the bumps on the die or onto the traces on the substrate; the adhesive is partly cured during the mating process, and the partly cured adhesive serves to confine the molten solder during a reflow process.

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patent: 2001/0013423 (2001-08-01), Dalal et al.

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