4. Semiconductor device manufacturing: process
  5. Coating with electrically or thermally conductive material
  6. To form ohmic contact to semiconductive material

Chikao Ikenaga

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Frame for semiconductor package

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate

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Frame for semiconductor package

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate

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Frame for semiconductor package

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate

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Frame for semiconductor package including plural lead frames...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Reexamination Certificate

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Lead frame and semiconductor package having a groove formed...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Beam leads
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2264171

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