Frame for semiconductor package

Details Frame for semiconductor package Frame for semiconductor package

2007-07-24

2007-07-24

Whitehead, Jr., Carl (Department: 2813)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Reexamination Certificate

active

11017896

ABSTRACT:
A frame for a semiconductor package has die-pads supported with suspending leads of individual lead frames. Semiconductor devices are arranged on the die-pads. These semiconductor devices are collectively molded with molding compound, and then the collectively molded semiconductor packages are cut into individual packages by means of a dicing saw. In the frame, suspending leads are formed into fish tails, wherein at least one of a longitudinal grid-lead and a transverse grid-lead is eliminated within areas enclosed with fish tails of the suspending leads. Accordingly, whether an R-shape generated by producing the frame by etching is large or small, the existence of metal pieces at the edges of the semiconductor packages is substantially prevented.

REFERENCES:
patent: 4390598 (1983-06-01), Phy
patent: 5318926 (1994-06-01), Dlugokecki
patent: 6812552 (2004-11-01), Islam et al.

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