Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Beam leads
Reexamination Certificate
2005-04-19
2005-04-19
Flynn, Nathan J. (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Beam leads
C257S735000, C257S692000, C257S690000, C257S677000, C257S674000, C257S666000
Reexamination Certificate
active
06882048
ABSTRACT:
A lead frame used for the production of a semiconductor package, wherein each of terminals of the lead frame to be wire-bonded to electrodes provided on the top surface of the semiconductor device has one or two groove(s) for limiting a plating area of noble metal. Since grooves are provided in each terminal, the accuracy of the plating area can be easily checked visually. Further, the grooves absorb stress applied to the terminal when the molded semiconductor packages are individually separated from each other by punching or dicing, and the situation where molding compound comes off of the terminal is prevented. In addition, since the grooves absorb vibrational stress applied to the terminal after mounting a semiconductor on the printed circuit board, the reliability of assembly is improved.
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Ikenaga Chikao
Tomita Kouji
Dainippon Printing Co., Ltd.
Flynn Nathan J.
Flynn ,Thiel, Boutell & Tanis, P.C.
Mandala Jr. Victor A.
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