4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Combined with electrical contact or lead
  6. Bump leads

Chikage Noritake

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Method for manufacturing semiconductor device having solder...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Method for manufacturing semiconductor device having...

Semiconductor device manufacturing: process – Chemical etching
Reexamination Certificate

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Method for manufacturing semiconductor power device

Semiconductor device manufacturing: process – Bonding of plural semiconductor substrates – Thinning of semiconductor substrate
Reexamination Certificate

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Semiconductor device having tin-based solder layer and...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate

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Semiconductor device with bump structure

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Patent

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Profile ID: LFUS-PAI-P-311615

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