Metal founding
Process
Shaping liquid metal against a forming surface
Inventor
active
Adhesion enhancement for metal/dielectric interface
Adopting feature of buried electrically conductive layer in...
Adopting feature of buried electrically conductive layer in...
Adopting feature of buried electrically conductive layer in...
Air gap structure having protective metal silicide pads on a...
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Profile ID: LFUS-PAI-P-563131