Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Inventor
active
Aluminum cap for reducing scratch and wire-bond bridging of...
Enhanced reliability of wafer-level chip-scale packaging...
Fixture for P-through silicon via assembly
IC chip package structure and underfill process
Low CTE substrates for use with low-k flip-chip package devices
No associations
LandOfFree
Chien-Hsiun Lee does not yet have a rating. At this time, there are no reviews or comments for this inventor.
If you have personal experience with Chien-Hsiun Lee, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Chien-Hsiun Lee will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-P-2175184