Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate
2008-04-22
2010-11-30
Smoot, Stephen W (Department: 2813)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Assembly of plural semiconductive substrates each possessing...
C438S458000, C438S459000, C257SE21516
Reexamination Certificate
active
07842548
ABSTRACT:
A silicon-based wafer such as a TSV interposer wafer having a first and second surfaces wherein a glass carrier is mounted on the second surface by a UV tape is held by a vacuum holder applied on the first surface and the glass carrier is removed from the silicon-based wafer by irradiating the UV tape with a UV light through the glass carrier. The silicon-based wafer is then flipped and placed onto a vacuum plate and secured to the vacuum plate by applying vacuum to the vacuum plate. The vacuum holder is then released from the silicon-based wafer leaving the silicon-based wafer secured to the vacuum plate for subsequent processing steps.
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Chen Chen-Shien
Karta Tjandra Winata
Lee Chien-Hsiun
Lii Mirng-Ji
Duane Morris LLP
Smoot Stephen W
Taiwan Semconductor Manufacturing Co., Ltd.
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