4. Semiconductor device manufacturing: process
  5. Chemical etching
  6. Combined with the removal of material by nonchemical means

Chi-Fa Lin

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Advanced IC bonding pad design for preventing stress induced pas

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Patent

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Combined in-situ high density plasma enhanced chemical vapor dep

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Patent

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Combined in-situ high density plasma enhanced chemical vapor dep

Active solid-state devices (e.g. – transistors – solid-state diode – With means to control surface effects – Insulating coating
Patent

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High density plasma enhanced chemical vapor deposition process i

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Patent

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Method for mapping and adjusting pressure distribution of CMP pr

Semiconductor device manufacturing: process – Chemical etching – Combined with the removal of material by nonchemical means
Patent

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Profile ID: LFUS-PAI-P-581345

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