4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Housing or package
  6. With contact or lead

Cécile Aulnette

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Film taking-off method

Semiconductor device manufacturing: process – Bonding of plural semiconductor substrates – Subsequent separation into plural bodies
Reexamination Certificate

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Indirect bonding with disappearance of bonding layer

Semiconductor device manufacturing: process – Coating of substrate containing semiconductor region or of... – Multiple layers
Reexamination Certificate

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Method and apparatus for adjusting the thickness of a thin...

Semiconductor device manufacturing: process – With measuring or testing
Reexamination Certificate

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Method for concurrently producing at least a pair of...

Semiconductor device manufacturing: process – Bonding of plural semiconductor substrates – Subsequent separation into plural bodies
Reexamination Certificate

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Method for concurrently producing at least a pair of...

Semiconductor device manufacturing: process – Bonding of plural semiconductor substrates
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2388723

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