Method and apparatus for adjusting the thickness of a thin...

Details Method and apparatus for adjusting the thickness of a thin... Method and apparatus for adjusting the thickness of a thin...

2005-06-21

2005-06-21

Dang, Phuc T. (Department: 2818)

Semiconductor device manufacturing: process

With measuring or testing

C438S770000, C438S981000

Reexamination Certificate

active

06908774

ABSTRACT:
A method for adjusting the thickness of a thin semiconductor material layer. The method includes measuring the layer to establish a thickness profile, determining thickness adjustment specifications from the measured thickness profile, and adjusting the thickness of the layer in accordance with the specifications by sacrificial oxidation. An apparatus for adjusting the thickness of a thin layer of semiconductor material according to this method is also disclosed.

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patent: WO 02 257 08 (2002-03-01), None

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