4. Semiconductor device manufacturing: process
  5. Bonding of plural semiconductor substrates
  6. Subsequent separation into plural bodies

Bruce Faure

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Composite structure with high heat dissipation

Active solid-state devices (e.g. – transistors – solid-state diode – Physical configuration of semiconductor
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Composite structure with high heat dissipation

Semiconductor device manufacturing: process – Bonding of plural semiconductor substrates
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Method for fabricating a carrier substrate

Single-crystal – oriented-crystal – and epitaxy growth processes; – Forming from vapor or gaseous state – With decomposition of a precursor
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Method for fabricating an epitaxial substrate

Single-crystal – oriented-crystal – and epitaxy growth processes; – Forming from vapor or gaseous state – With decomposition of a precursor
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Method of fabricating an epitaxially grown layer

Single-crystal – oriented-crystal – and epitaxy growth processes; – Forming from vapor or gaseous state – With decomposition of a precursor
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Profile ID: LFUS-PAI-P-2161394

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