4. Cleaning and liquid contact with solids
  5. Processes
  6. Combined

Andrew Simon

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Constant emissivity deposition member

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Dual damascene interconnect structures having different...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reexamination Certificate

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Dual damascene interconnect structures having different...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Method and structure for improving electromigration of chip...

Semiconductor device manufacturing: process – Electromigration resistant metallization
Reexamination Certificate

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Microstructure liner having improved adhesion

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reexamination Certificate

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Profile ID: LFUS-PAI-P-819362

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