Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2006-05-02
2006-05-02
Lee, Hsien-Ming (Department: 2823)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
C438S681000, C438S800000, C427S585000, C118S715000
Reexamination Certificate
active
07037834
ABSTRACT:
A deposition member adapted for discharging a deposition material during a deposition process can acquire a coating during the deposition. Such an initial emissivity value is selected for the deposition member, before any of the coating became deposited, that the emissivity of the deposition member remains substantially unchanged during the deposition process. In a representative embodiment the deposition member is coated with an appropriate thin layer for achieving the selected emissivity value.
REFERENCES:
patent: 6313035 (2001-11-01), Sandhu et al.
patent: 6454860 (2002-09-01), Metzner et al.
patent: 6582522 (2003-06-01), Luo et al.
patent: 6802906 (2004-10-01), Jin et al.
patent: 2002/0192370 (2002-12-01), Metzner
Malhotra Sandra
McFeely Fenton Read
Simon Andrew
Yurkas John Jacob
Cheung Wan Yee
Lee Hsien-Ming
Sai-Halasz George
LandOfFree
Constant emissivity deposition member does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Constant emissivity deposition member, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Constant emissivity deposition member will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3546473