4. Electricity: conductors and insulators
  5. Boxes and housings
  6. Hermetic sealed envelope type

Ahmad Hamzehdoost

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BGA package using PCB and tape in a die-down configuration

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent

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BGA package using PCB and tape in a die-up configuration

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified configuration
Patent

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Cavity down HBGA package structure

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Patent

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Method of assembling and cooling a package structure with access

Metal working – Method of mechanical manufacture – Electrical device making
Patent

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Method of fabricating a BGA package using PCB and tape in a...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Including adhesive bonding step
Reexamination Certificate

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Profile ID: LFUS-PAI-P-391866

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