Method of assembling and cooling a package structure with access

Details Method of assembling and cooling a package structure with access Method of assembling and cooling a package structure with access

1996-01-11

1997-11-18

Echols, P. W.

Metal working

Method of mechanical manufacture

Electrical device making

H05K 330

Patent

active

056874740

ABSTRACT:
A package for an integrated-circuit includes a package body having a die-cavity formed therein. A die-attach pad is formed in the package body adjacent the die-cavity. An opening is formed in the central portion of the die-attach pad for exposing one side of the integrated-circuit die so that an external cooling media can directly contact the exposed side of the integrated-circuit die. The die-attach pad can be formed as a die-mounting ring adjacent the die-attach cavity. The peripheral edge of the integrated-circuit die is fixed to a mounting surface on the die-mounting ring portion to accommodate direct cooling of the exposed side of the integrated-circuit die. The mounting surface of the die-mounting ring extends beyond the peripheral edge of the integrated-circuit die to accommodate a range of sizes of the integrated-circuit die. The exposed surface of the integrated circuit die is cooled, for example, with a cooling fluid, a heatsink, or a thermo-electric refrigeration unit in contact with the exposed side of the die. The exposed side of the die is coated with a film to provide a seal for the exposed side of the integrated-circuit die.

REFERENCES:
patent: 4493145 (1985-01-01), Honda
patent: 4876588 (1989-10-01), Miyamoto
patent: 4996587 (1991-02-01), Hinrichsmeyer
patent: 5105259 (1992-04-01), McShane et al.

Affiliated with

Also associated with

Rating

Method of assembling and cooling a package structure with access does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of assembling and cooling a package structure with access, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of assembling and cooling a package structure with access will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1556831