BGA package using PCB and tape in a die-down configuration

Details BGA package using PCB and tape in a die-down configuration BGA package using PCB and tape in a die-down configuration

1998-11-18

1999-12-07

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361718, 361720, 361749, 361764, 361767, 257703, 257707, 257738, 257778, 257784, 438122, H05K 111, H05K 720

Patent

active

059994150

ABSTRACT:
A die-down HBGA package includes an integrated-circuit die mounted to a substantially flat lower surface of a die-carrier/heat spreader. A flexible insulated tape layer with a central opening for the die has its upper surface adhesively fixed to the lower side of the die-carrier/heat spreader. Wire-bonding sites and a number of contact areas are connected by traces on the lower surface of the tape layer. Bonding-wire loops are connected between the wire-bonding pads on the die and the wire-bonding sites on the insulated tape layer. A rigid board, such as an epoxy or ceramic circuit board, with electrically conductive plated-through holes is fixed to the insulated flexible tape layer with adhesive. Conductive adhesive material connects the contact areas with the top surfaces of the plated-through holes. Alternatively, pins join the carrier/heat spreader and the rigid circuit board. Solder pads for solder balls are formed on the bottom surface of the printed-circuit board.

REFERENCES:
patent: 5477082 (1995-12-01), Buckley, III et al.
patent: 5583378 (1996-12-01), Marrs et al.
patent: 5659952 (1997-08-01), Kovac et al.
patent: 5729051 (1998-03-01), Nakamura
patent: 5814883 (1998-09-01), Sawai et al.
patent: 5834839 (1998-11-01), Mertol

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