Microelectronic die assembly having thermally conductive...

Details Microelectronic die assembly having thermally conductive... Microelectronic die assembly having thermally conductive...

2006-09-29

2009-12-01

Clark, Jasmine J (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With heat sink means

C257S706000, C257S707000, C257S719000, C257SE23051, C257SE23101

Reexamination Certificate

active

07626251

ABSTRACT:
A microelectronic die assembly. The die assembly includes a microelectronic die, and a thermally conductive element attached to the backside of the die with a thermal interface material. The thermally conductive element has lateral dimensions smaller than, substantially equal to, or larger than lateral dimensions of the die by up to a maximum amount, wherein the maximum amount is adapted to allow a mounting of the die assembly to a package substrate.

REFERENCES:
patent: 6114761 (2000-09-01), Mertol et al.
patent: 7148122 (2006-12-01), Shaheen et al.
patent: 2002/0105071 (2002-08-01), Mahajan et al.
patent: 2007/0216009 (2007-09-01), Ng
patent: 2007/0262421 (2007-11-01), Lehman et al.

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