4. Electrical connectors
  5. Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
  6. With provision to conduct electricity from panel circuit to...

Daoqiang Lu

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Adhesive with differential optical properties and its...

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Reexamination Certificate

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Adhesive with differential optical properties and its...

Compositions – Organic luminescent material containing compositions – Optical brightening compositions
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Apparatus and method for attaching a semiconductor die to a...

Metal fusion bonding – Process – With pretreating other than heating or cooling of work part...
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Assembly of thin die coreless package

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
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Bumpless die and heat spreader lid module bonded to bumped...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
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Profile ID: LFUS-PAI-P-2298844

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