4. Electricity: measuring and testing
  5. Impedance, admittance or other quantities representative of...
  6. Lumped type parameters

Dongming He

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C4 joint reliability

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Reexamination Certificate

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Embedded on-die laser source and optical interconnect

Optical waveguides – Integrated optical circuit
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Integrated circuit packages with reduced stress on die and...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
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Integrated circuit packages with reduced stress on die and...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
Reexamination Certificate

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Integrated thin film liquid conductivity sensor

Electricity: measuring and testing – Impedance – admittance or other quantities representative of... – Lumped type parameters
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Profile ID: LFUS-PAI-P-2655823

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