4. Semiconductor device manufacturing: process
  5. Packaging or treatment of packaged semiconductor

Chuan Hu

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Bumpless die and heat spreader lid module bonded to bumped...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Reexamination Certificate

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Die-warpage compensation structures for thinned-die devices,...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

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Electronic assemblies having a low processing temperature

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate

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Electronic assemblies having a low processing temperature

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate

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Electronic packages, assemblies, and systems with fluid cooling

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
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Profile ID: LFUS-PAI-P-2378456

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