Plasma immersion ion implantation process using a...

Semiconductor device manufacturing: process – Introduction of conductivity modifying dopant into...

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C438S514000, C156S345370

Reexamination Certificate

active

11284975

ABSTRACT:
A method of ion implanting a species in a workpiece to a selected ion implantation profile depth includes placing a workpiece having a semiconductor material on an electrostatic chuck in or near a processing region of a plasma reactor chamber and applying a chucking voltage to the electrostatic chuck. The method further includes introducing into the chamber a precursor gas including a species to be ion implanted in the workpiece and applying an RF bias to the electrostatic chuck, the RF bias having a bias level corresponding to the ion implantation profile depth.

REFERENCES:
patent: 2344138 (1944-03-01), Drummond
patent: 3109100 (1963-10-01), Gecewicz
patent: 3576685 (1971-04-01), Swann et al.
patent: 3907616 (1975-09-01), Wiemer
patent: 4116791 (1978-09-01), Zega
patent: 4176003 (1979-11-01), Brower et al.
patent: 4382099 (1983-05-01), Legge et al.
patent: 4385946 (1983-05-01), Finegan et al.
patent: 4434036 (1984-02-01), Hoerschelmann et al.
patent: 4465529 (1984-08-01), Arima et al.
patent: 4481229 (1984-11-01), Suzuki et al.
patent: 4500563 (1985-02-01), Ellenberger et al.
patent: 4521441 (1985-06-01), Flowers
patent: 4539217 (1985-09-01), Farley
patent: 4565588 (1986-01-01), Seki et al.
patent: 4579618 (1986-04-01), Celestino et al.
patent: 4584026 (1986-04-01), Wu et al.
patent: 4698104 (1987-10-01), Barker et al.
patent: 4764394 (1988-08-01), Conrad
patent: 4778561 (1988-10-01), Ghanbari
patent: 4867859 (1989-09-01), Harada et al.
patent: 4871421 (1989-10-01), Ogle et al.
patent: 4892753 (1990-01-01), Weng et al.
patent: 4912065 (1990-03-01), Mizuno et al.
patent: 4937205 (1990-06-01), Nakayama et al.
patent: 4948458 (1990-08-01), Ogle
patent: 5040046 (1991-08-01), Chhabra et al.
patent: 5061838 (1991-10-01), Lane et al.
patent: 5074456 (1991-12-01), Degner et al.
patent: 5106827 (1992-04-01), Borden et al.
patent: 5107201 (1992-04-01), Ogle
patent: 5229305 (1993-07-01), Baker
patent: 5270250 (1993-12-01), Murai et al.
patent: 5277751 (1994-01-01), Ogle
patent: 5288650 (1994-02-01), Sandow
patent: 5290382 (1994-03-01), Zarowin et al.
patent: 5312778 (1994-05-01), Collins et al.
patent: 5354381 (1994-10-01), Sheng
patent: 5423945 (1995-06-01), Marks et al.
patent: 5435881 (1995-07-01), Ogle
patent: 5505780 (1996-04-01), Dalvie et al.
patent: 5510011 (1996-04-01), Okamura et al.
patent: 5514603 (1996-05-01), Sato
patent: 5520209 (1996-05-01), Goins et al.
patent: 5542559 (1996-08-01), Kawakami et al.
patent: 5561072 (1996-10-01), Saito
patent: 5569363 (1996-10-01), Bayer et al.
patent: 5571366 (1996-11-01), Ishii et al.
patent: 5572038 (1996-11-01), Sheng et al.
patent: 5587038 (1996-12-01), Cecchi et al.
patent: 5627435 (1997-05-01), Jansen et al.
patent: 5643838 (1997-07-01), Dean et al.
patent: 5648701 (1997-07-01), Hooke et al.
patent: 5653811 (1997-08-01), Chan
patent: 5654043 (1997-08-01), Shao et al.
patent: 5660895 (1997-08-01), Lee et al.
patent: 5665640 (1997-09-01), Foster et al.
patent: 5674321 (1997-10-01), Pu et al.
patent: 5683517 (1997-11-01), Shan
patent: 5711812 (1998-01-01), Chapek et al.
patent: 5718798 (1998-02-01), Deregibus
patent: 5770982 (1998-06-01), Moore
patent: 5885358 (1999-03-01), Maydan et al.
patent: 5888413 (1999-03-01), Okumura et al.
patent: 5897713 (1999-04-01), Tomioka et al.
patent: 5897752 (1999-04-01), Hong et al.
patent: 5911832 (1999-06-01), Denholm et al.
patent: 5935077 (1999-08-01), Ogle
patent: 5935373 (1999-08-01), Koshimizu
patent: 5944942 (1999-08-01), Ogle
patent: 5948168 (1999-09-01), Shan et al.
patent: 5958140 (1999-09-01), Arami et al.
patent: 5985742 (1999-11-01), Henley et al.
patent: 5994207 (1999-11-01), Henley et al.
patent: 5994236 (1999-11-01), Ogle
patent: 5998933 (1999-12-01), Shun'ko
patent: 6000360 (1999-12-01), Koshimuzu
patent: 6013567 (2000-01-01), Henley et al.
patent: 6020592 (2000-02-01), Liebert et al.
patent: 6041735 (2000-03-01), Murzin et al.
patent: 6050218 (2000-04-01), Chen et al.
patent: 6076483 (2000-06-01), Shintani et al.
patent: 6096661 (2000-08-01), Ngo et al.
patent: 6101971 (2000-08-01), Denholm et al.
patent: 6103599 (2000-08-01), Henley et al.
patent: 6121161 (2000-09-01), Rossman et al.
patent: 6132552 (2000-10-01), Donohoe et al.
patent: 6139697 (2000-10-01), Chen et al.
patent: 6150628 (2000-11-01), Smith et al.
patent: 6153524 (2000-11-01), Henley et al.
patent: 6155090 (2000-12-01), Rubenson
patent: 6164241 (2000-12-01), Chen et al.
patent: 6165376 (2000-12-01), Miyake et al.
patent: 6174450 (2001-01-01), Patrick et al.
patent: 6174743 (2001-01-01), Pangrle et al.
patent: 6180496 (2001-01-01), Farrens et al.
patent: 6182604 (2001-02-01), Goeckner et al.
patent: 6187110 (2001-02-01), Henley et al.
patent: 6207005 (2001-03-01), Henley et al.
patent: 6237527 (2001-05-01), Kellerman et al.
patent: 6239553 (2001-05-01), Barnes et al.
patent: 6248642 (2001-06-01), Donlan et al.
patent: 6265328 (2001-07-01), Henley et al.
patent: 6291313 (2001-09-01), Henley et al.
patent: 6291939 (2001-09-01), Nishida
patent: 6300643 (2001-10-01), Fang et al.
patent: 6303519 (2001-10-01), Hsiao et al.
patent: 6305316 (2001-10-01), DiVergilio et al.
patent: 6335536 (2002-01-01), Goeckner et al.
patent: 6339297 (2002-01-01), Sugai et al.
patent: 6341574 (2002-01-01), Bailey, III et al.
patent: 6348126 (2002-02-01), Hanwa et al.
patent: 6350697 (2002-02-01), Richardson et al.
patent: 6387719 (2002-05-01), Mvros et al.
patent: 6392351 (2002-05-01), Shun'ko
patent: 6395150 (2002-05-01), Van Cleemput et al.
patent: 6403453 (2002-06-01), Ono et al.
patent: 6410449 (2002-06-01), Hanawa et al.
patent: 6413321 (2002-07-01), Kim et al.
patent: 6417078 (2002-07-01), Dolan et al.
patent: 6418874 (2002-07-01), Cox et al.
patent: 6426015 (2002-07-01), Xia et al.
patent: 6432260 (2002-08-01), Mahoney et al.
patent: 6433553 (2002-08-01), Goeckner et al.
patent: 6453842 (2002-09-01), Hanawa et al.
patent: 6461972 (2002-10-01), Kabansky
patent: 6468388 (2002-10-01), Hanawa et al.
patent: 6492612 (2002-12-01), Taguchi et al.
patent: 6494986 (2002-12-01), Hanawa et al.
patent: 6511899 (2003-01-01), Henley et al.
patent: 6513538 (2003-02-01), Chung et al.
patent: 6514838 (2003-02-01), Chan
patent: 6528391 (2003-03-01), Henley et al.
patent: 6551446 (2003-04-01), Hanwa et al.
patent: 6558508 (2003-05-01), Kawakami
patent: 6559408 (2003-05-01), Smith et al.
patent: 6579805 (2003-06-01), Bar-Gadda
patent: 6582999 (2003-06-01), Henley et al.
patent: 6593173 (2003-07-01), Anc et al.
patent: 6643557 (2003-11-01), Miller et al.
patent: 6645828 (2003-11-01), Farrens et al.
patent: 6679981 (2004-01-01), Pan et al.
patent: 6780759 (2004-08-01), Farrens et al.
patent: 6800559 (2004-10-01), Bar-Gadda
patent: 6811448 (2004-11-01), Paton et al.
patent: 6838695 (2005-01-01), Doris et al.
patent: 7037813 (2006-05-01), Collins et al.
patent: 7094670 (2006-08-01), Collins et al.
patent: 2001/0042827 (2001-11-01), Fang et al.
patent: 2002/0036881 (2002-03-01), Shamouilian et al.
patent: 2002/0047543 (2002-04-01), Sugai et al.
patent: 2002/0053513 (2002-05-01), Stimson et al.
patent: 2003/0013260 (2003-01-01), Gossman et al.
patent: 2003/0013314 (2003-01-01), Ying et al.
patent: 2003/0029567 (2003-02-01), Dhindsa et al.
patent: 2003/0085205 (2003-05-01), Lai et al.
patent: 2003/0211705 (2003-11-01), Tong et al.
patent: 2004/0036038 (2004-02-01), Okumura et al.
patent: 2004/0092084 (2004-05-01), Rayssac
patent: 2004/0126993 (2004-07-01), Chan et al.
patent: 0 546 852 (1993-06-01), None
patent: 0 836 218 (1998-04-01), None
patent: 0 964 074 (1999-12-01), None
patent: 1 054 433 (2000-11-01), None
patent: 1 111 084 (2001-06-01), None
patent: 1 158 071 (2001-11-01), None
patent: 1 191 121 (2002-03-01), None
patent: 59-86214 (1984-05-01), None
patent: 59-218728 (1984-12-01), None
patent: 62-120041 (1987-06-01), None
patent: 04318168 (1992-09-01), None
patent: 07045542 (1995-02-01), None
patent: 07130496 (1995-05-01), None
patent: 09186337 (1997-07-01), None
patent: 200150908 (2000-05-01), None
patent: WO 99/00832 (1999-01-01), None
patent: WO 01/11650 (2001-02-01), None
patent: WO 02/25694 (2002-03-01), None
patent: WO 93/18201 (2003-09-01), None
C

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Plasma immersion ion implantation process using a... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Plasma immersion ion implantation process using a..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Plasma immersion ion implantation process using a... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3866179

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.