4. Semiconductor device manufacturing: process
  5. Packaging or treatment of packaged semiconductor

Chippac Inc.

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Bump-on-lead flip chip interconnection

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead
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Flip chip interconnection pad layout

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated
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Method and apparatus for flip chip attachment by post...

Metal fusion bonding – Process – Plural joints
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Method for making a semiconductor multi-package module...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
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Method for making a semiconductor multipackage module...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
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Profile ID: LFUS-PAI-P-3102261

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