4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Combined with electrical contact or lead
  6. Wire contact, lead, or bond

Ki-Youn Jang

Inventor

Rate now
  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

Inventor

active

Method of forming vertically offset bond on trace...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Semiconductor device and method of forming vertically offset...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Wire bond capillary tip

Metal fusion bonding – With means to juxtapose and bond plural workpieces – Wire lead bonder
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Wire bond interconnection

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Wire contact – lead – or bond
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Wire bond interconnection

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Wire contact – lead – or bond
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

No associations

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Ki-Youn Jang does not yet have a rating. At this time, there are no reviews or comments for this inventor.

If you have personal experience with Ki-Youn Jang, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Ki-Youn Jang will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-P-2249273

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.

Canada

 Charities
 Companies
 MP Candidates
 Patents
 Employee Salary Disclosure

World

 Places of the World
 Scientific Papers

United States

 Banks
 Companies
 Counties
 Patents
 Employee Salary Disclosure