4. Electricity: electrical systems and devices
  5. Housing or mounting assemblies with diverse electrical...
  6. For electronic systems and devices

Rajendra D. Pendse

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Apparatus and method for precise alignment of a ceramic module t

Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element
Patent

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Bump-on-lead flip chip interconnection

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead
Reexamination Certificate

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Bump-on-lead flip chip interconnection

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Bump-on-lead flip chip interconnection

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead
Reexamination Certificate

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Bump-on-lead flip chip interconnection

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate

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Profile ID: LFUS-PAI-P-67012

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