4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Combined with electrical contact or lead
  6. Wire contact, lead, or bond

Chul-Sik Kim

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Method of manufacturing a semiconductor package with fine...

Metal fusion bonding – Process – Plural joints
Reexamination Certificate

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Semiconductor system with fine pitch lead fingers

Metal fusion bonding – Process – Plural joints
Reexamination Certificate

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Wire bond interconnection

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Wire contact – lead – or bond
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Wire bond interconnection

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Wire contact – lead – or bond
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Wire bond interconnection

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2249272

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