Wafer spacing mask for a substrate support chuck and method of f

Coating apparatus – Gas or vapor deposition – Work support

Patent

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Details

20429815, 156345, 279128, 361234, 118500, 118503, 118504, 269903, C23C 1600, C23C 1450

Patent

active

056560931

ABSTRACT:
A wafer spacing mask for supporting a workpiece in a spaced apart relation to a workpiece support chuck. More specifically, the wafer spacing mask contains a plurality of metallic support members deposited upon the support surface of the chuck. The support members maintain a wafer, or other workpiece, in a spaced apart relation to the support surface of the chuck. The distance between the underside surface of the wafer and the chuck is defined by the thickness of the support members. This distance should be larger than the expected diameter of contaminant particles that may lie on the surface of the chuck. In this manner, the contaminant particles do not adhere to the underside of the wafer during processing.

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Watanabe et al., "Electrostati Force and Absorption Current of Alumina Electrostatic Chuck", Jpn. J. Appl. Phys., vol. 31, No. 7, pp. 2145-2150, Jul. 1992.

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