Semiconductor device manufacturing: process – Bonding of plural semiconductor substrates
Reexamination Certificate
2006-02-14
2006-02-14
Deo, Duy-Vu N. (Department: 1765)
Semiconductor device manufacturing: process
Bonding of plural semiconductor substrates
C438S456000, C438S459000
Reexamination Certificate
active
06998327
ABSTRACT:
A thin film transfer join process in which a multilevel thin film structure is formed on a carrier, the multilevel thin film structure is joined to a final substrate and then the carrier is removed. Once the carrier is removed, the dielectric material and metallic material that were once joined to the carrier are now exposed. The dielectric material is then etched back so that the exposed metallic material protrudes beyond the dielectric material. Also disclosed is a module made by the foregoing process.
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Danielson Jeffrey B.
Ghosal Balaram
Kuss James
Oonk Matthew Wayne
Perfecto Eric Daniel
Blecker Ira D.
Deo Duy-Vu N.
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