4. Semiconductor device manufacturing: process
  5. Packaging or treatment of packaged semiconductor
  6. Metallic housing or support

Ira D. Blecker

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Apparatus and method for removing a bonded lid from a substrate

Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – With microwave gas energizing means
Reexamination Certificate

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Apparatus for cleaning residual material from an article

Chemistry: electrical and wave energy – Apparatus – Electrolytic
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Article extraction / insertion tool and assembly

Metal working – Means to assemble or disassemble – Means to assemble electrical device
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Back end interconnect with a shaped interface

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Back end interconnect with a shaped interface

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2015878

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