4. Coating processes
  5. Measuring, testing, or indicating

Eric Daniel Perfecto

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Apparatus and method for use in manufacturing semiconductor devi

Metal fusion bonding – Including means to apply flux or filler to work or applicator
Patent

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Apparatus and method for use in manufacturing semiconductor...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Apparatus for providing solder interconnections to semiconductor

Stock material or miscellaneous articles – Structurally defined web or sheet – Including sheet or component perpendicular to plane of web...
Patent

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Capped copper electrical interconnects

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Patent

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Capped copper electrical interconnects

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Patent

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Profile ID: LFUS-PAI-P-120192

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