4. Electricity: conductors and insulators
  5. Conduits, cables or conductors
  6. Conductor structure

Balaram Ghosal

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Interconnections for flip-chip using lead-free solders and...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Reexamination Certificate

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Interconnections for flip-chip using lead-free solders and...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate

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Method for selectively coating a member having a shank by maskin

Coating processes – Nonuniform coating – Mask or stencil utilized
Patent

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Method of joining an electrical contact element to a substrate

Fishing – trapping – and vermin destroying
Patent

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Selectively coated member having a shank with a portion masked

Electricity: conductors and insulators – Conduits – cables or conductors – Conductor structure
Patent

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Profile ID: LFUS-PAI-P-702548

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