Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Reexamination Certificate
2006-01-24
2006-01-24
Pham, Hoai (Department: 2814)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Flip chip
C257S685000, C257S723000
Reexamination Certificate
active
06989607
ABSTRACT:
A method and structure to electrically couple a semiconductor device to a substrate that is divided into a plurality of segments. Alternatively, a semiconductor device may be divided into a plurality of segments and the plurality of segments are electrically coupled to a single substrate.
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Darbha Krishna
Jimarez Miguel A.
Reiss Matthew M.
Sathe Sanjeev B.
Woychik Charles G.
Nguyen Dilinh
Pham Hoai
Schmeiser Olsen & Watts
Steinberg William H.
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