Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Flip chip
Inventor
active
Apparatus to reduce thermal fatigue stress on flip chip...
Method of forming an apparatus to reduce thermal fatigue...
Stress reduction in flip-chip PBGA packaging by utilizing...
Stress reduction in flip-chip PBGA packaging by utilizing...
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Profile ID: LFUS-PAI-P-2621923