4. Alloys or metallic compositions
  5. Tin base

Charles G. Woychik

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Apparatus to reduce thermal fatigue stress on flip chip...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Reexamination Certificate

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Bonding of metallic surfaces

Metal fusion bonding – Process – Bonding nonmetals with metallic filler
Patent

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CT detector module construction

X-ray or gamma ray systems or devices – Specific application – Computerized tomography
Reexamination Certificate

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Lead-free solder process

Metal fusion bonding – Process – Plural joints
Patent

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Lead-free, high tin ternary solder alloy of tin, silver, and ind

Alloys or metallic compositions – Tin base
Patent

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Profile ID: LFUS-PAI-P-508023

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