Active solid-state devices (e.g., transistors, solid-state diode
Integrated circuit structure with electrically isolated...
Passive components in ics
Examiner
active
No affiliations
Array of nanoscopic mosfet transistors and fabrication methods
Balanced coefficient of thermal expansion for flip chip ball...
Ball grid array package with shielding
Chip size stack package and method of fabricating the same
Common connection method for flip-chip assembled devices
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Profile ID: LFUS-PAI-P-2075608