Metal fusion bonding – Process – Preplacing solid filler
Patent
1996-07-02
1999-02-09
Ryan, Patrick
Metal fusion bonding
Process
Preplacing solid filler
22818022, 228 495, 228 447, B23K 3102
Patent
active
058683046
ABSTRACT:
An electronic component having a socketable bump grid array comprising shaped-solder coated metallic spheres is provided by a method which comprises positioning solder coated metal spheres in an aligning device having a plurality of opening corresponding to the array, the openings being tapered preferably in the form of a truncated cone with the base of the cone being at the upper surface of the aligning device and having a diameter larger than the diameter of the solder coated metal sphere. The opening is configured so that a sphere positioned in the opening extends partially above the upper surface of the aligning device. The pads of the substrate are then contacted with the positioned spheres and, when the solder is reflowed, the solder forms a bond between the conductive layer on the substrate in contact with the solder-coated metal sphere and takes the shape of the aligning device and which maintains a solder coating on the whole surface of the metal sphere. An apparatus is also provided for making such a socketable bump grid array.
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Abstract of JP 07099385-A (Apr. 11, 1995).
Brofman Peter Jeffrey
Ghosal Balaram
Jackson Raymond Alan
Lidestri Kathleen Ann
Puttlitz, Sr. Karl J.
Ahsan Aziz M.
International Business Machines - Corporation
Knapp Jeffrey T.
Ryan Patrick
Tomaszewski John J.
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