4. Metal fusion bonding
  5. Process
  6. Preplacing solid filler

Karl J. Puttlitz, Sr.

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Lead-free tin-silver-copper alloy solder composition

Stock material or miscellaneous articles – All metal or with adjacent metals – Composite; i.e. – plural – adjacent – spatially distinct metal...
Reexamination Certificate

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Mechanical attachment means used as electrical connection

Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Reexamination Certificate

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Socketable bump grid array shaped-solder on copper spheres

Metal fusion bonding – Process – Preplacing solid filler
Patent

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Socketable bump grid array shaped-solder on copper spheres

Metal fusion bonding – Solder form
Patent

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Profile ID: LFUS-PAI-P-1758271

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