4. Metal fusion bonding
  5. Process
  6. Preplacing solid filler

Peter Jeffrey Brofman

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Process for forming cone shaped solder for chip interconnection

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
Reexamination Certificate

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Process for forming cone shaped solder for chip interconnection

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate

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Socketable bump grid array shaped-solder on copper spheres

Metal fusion bonding – Process – Preplacing solid filler
Patent

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Socketable bump grid array shaped-solder on copper spheres

Metal fusion bonding – Solder form
Patent

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Profile ID: LFUS-PAI-P-1758270

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