Semiconductor package and method for increased thermal dissipati

Details Semiconductor package and method for increased thermal dissipati Semiconductor package and method for increased thermal dissipati

1998-04-07

2000-04-18

Whitehead, Jr., Carl

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Flip chip

257712, 257723, H01L 2348

Patent

active

06051888&

ABSTRACT:
The invention is a flip-chip semiconductor package (10) and the method of making, which includes a semiconductor chip (12) having face and back sides. The semiconductor chip (12) is connected face side to an insulated package base (11) utilizing solder balls (22). A heat spreader lid (17) is sealed to the back side of the semiconductor chip (12) and to the package base (11) with an electrically and thermally conductive adhesive (14,16).

REFERENCES:
patent: 5077633 (1991-12-01), Freyman et al.
patent: 5289337 (1994-02-01), Aghazadeh
patent: 5291371 (1994-03-01), Gruber et al.
patent: 5367196 (1994-11-01), Mahulikar et al.
patent: 5442234 (1995-08-01), Liang
patent: 5510649 (1996-04-01), Adhihetty et al.
patent: 5883430 (1999-03-01), Johnson et al.
patent: 5909057 (1999-06-01), McCormick et al.

Affiliated with

Also associated with

Rating

Semiconductor package and method for increased thermal dissipati does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor package and method for increased thermal dissipati, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor package and method for increased thermal dissipati will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2338235