4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Lead frame

Wade James Brady III

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Ablative bond pad formation

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Patent

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Active compensating capacitive multiplier

Amplifiers – With semiconductor amplifying device – Including differential amplifier
Patent

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Address controlled sense amplifier overdrive timing for semicond

Static information storage and retrieval – Read/write circuit – Flip-flop used for sensing
Patent

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Adjustable Bipolar SCR holding voltage for ESD protection circui

Active solid-state devices (e.g. – transistors – solid-state diode – Regenerative type switching device – Having only two terminals and no control electrode – e.g.,...
Patent

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Alignment apparatus for wire bonding capillary

Metal fusion bonding – With means to juxtapose and bond plural workpieces – Wire lead bonder
Patent

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Profile ID: LFUS-PAI-P-274252

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