4. Animal husbandry
  5. Exerciser or toy

Bill Kennedy

Attorney

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Chip scale package with flip chip interconnect

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate

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DBG system and method with adhesive layer severing

Semiconductor device manufacturing: process – Semiconductor substrate dicing
Reexamination Certificate

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Dendrimer constructs and metal complexes thereof having...

Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – From carboxylic acid or derivative thereof
Reexamination Certificate

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Flat leadless packages and stacked leadless package assemblies

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Reexamination Certificate

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Flip chip interconnection pad layout

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2019471

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