Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Of specified configuration
Examiner
active
No affiliations
3-D stackable semiconductor package
Alignment mark structure for laser fusing and method of use
Alignment using fiducial features
Alignment using fiducial features
Anisotropic conductive film bonding pad
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Profile ID: LFUS-PAI-P-2352450