4. Metal working
  5. Method of mechanical manufacture
  6. Electrical device making

Marcos Karnezos

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Anodic bonding method and apparatus for X-ray masks

Stock material or miscellaneous articles – Web or sheet containing structurally defined element or... – Physical dimension specified
Patent

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Ball grid array semiconductor package

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Patent

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Flex interconnect module

Electricity: electrical systems and devices – Electrostatic capacitors – Fixed capacitor
Patent

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Flip chip interconnection

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate

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Flip chip-in-leadframe package and process

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Profile ID: LFUS-PAI-P-697400

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