Self-timed AC CIO wrap method and apparatus

Details Self-timed AC CIO wrap method and apparatus Self-timed AC CIO wrap method and apparatus

1997-10-21

2000-05-02

Tu, Trinh L.

Error detection/correction and fault detection/recovery

Pulse or data error handling

Digital logic testing

324765, G01R 3128

Patent

active

060584963

ABSTRACT:
A method and apparatus for testing a semiconductor chip includes providing the semiconductor chip with a common input/output (I/O) or bidirectional I/O pad. The I/O pad is electrically coupled to an off-chip driver (OCD) and an off-chip receiver (OCR). The OCD, I/O pad, and OCR are combined in a common input/output (CIO) or bidirectional I/O configuration. The I/O pad is effectively open circuited by an external tester and a performance parameter of the IO circuits connected to the open circuited pad is tested.

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