Self aligned DMOS transistor and method of fabrication

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

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Details

438275, 438286, 438289, H01L 21336, H01L 218234

Patent

active

060252316

ABSTRACT:
A method for fabricating a self-aligned DMOS transistor is provided. The method includes forming a passivation layer (18, 68) on an oxide layer (16, 66) of a substrate (12, 56). The oxide layer (16, 66) is then removed from the surface of the substrate (12, 56) where it is exposed through the passivation layer (18, 68). A reduced surface field region (36, 74) is then formed where the surface of the substrate (12, 56) is exposed through the passivation layer (18, 68). An oxide layer (38, 80) is then formed on the reduced surface field region (36, 74).

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