Resolving pattern-loading issues of SiGe stressor

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C438S229000, C257S346000, C257SE21619, C257SE21634

Reexamination Certificate

active

07579248

ABSTRACT:
A method for improving uniformity of stressors of MOS devices is provided. The method includes forming a gate dielectric over a semiconductor substrate, forming a gate electrode on the gate dielectric, forming a spacer on respective sidewalls of the gate electrode and the gate dielectric, forming a recess in the semiconductor adjacent the spacer, and depositing SiGe in the recess to form a SiGe stressor. The method further includes etching the SiGe stressor to improve the uniformity of SiGe stressors.

REFERENCES:
patent: 2006/0088968 (2006-04-01), Shin et al.
patent: 2006/0115933 (2006-06-01), Ye et al.
patent: 2006/0240630 (2006-10-01), Bauer et al.
Huang, C.-C., et al., “Design and Integration of Strained SiGe/Si Hetero-Structure CMOS Transistors,” IEEE, 2005, pp. 23-24.
Ko, C.H., et al., “A Novel Process-Induced Strained Silicon (PSS) CMOS Technology for High-Performance Applications,” IEEE, 2005, pp. 25-26.
Ouyang, Q., et al., “Characteristics of High Performance PFETs with Embedded SiGe Source/Drain and <100> Channels on 45° Rotated Wafers,” IEEE, 2005, pp. 27-28.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Resolving pattern-loading issues of SiGe stressor does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Resolving pattern-loading issues of SiGe stressor, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Resolving pattern-loading issues of SiGe stressor will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-4099449

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.